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SEMICON Taiwan 2025 | Successfully Concluded
News2025.09.18
SEMICON Taiwan 2025 | Successfully Concluded
SEMICON Taiwan 2025 has come to a successful close, and API’s journey in Taipei wrapped up with recognition, achievements, and new opportunities.
Precision Integration, Ecosystem Collaboration: API Empowers Singapore’s Semiconductor Ecosystem Development
News2025.06.18
Precision Integration, Ecosystem Collaboration: API Empowers Singapore’s Semiconductor Ecosystem Development
As the global semiconductor industry accelerates toward heterogeneous integration and advanced packaging, Singapore – leveraging its mature industrial ecosystem .....
SEMICON SEA Mitec I kuala Lumpur, Malaysia Invitation
News2024.05.22
SEMICON SEA Mitec I kuala Lumpur, Malaysia Invitation

Visit our Booth: Hall 2-1524

Advanced Packaging Solutions:

. Ultra-Thin-Die Stacking Bonder

. Semiconductor Packaging Intelligence Inline Solution

. Advanced Bonder for Multi Chip/Module Attach

Advanced Pick & Place Equipment and Intelligent Inline Solution
News2024.05.18
Advanced Pick & Place Equipment and Intelligent Inline Solution
API facilitates to upgrade global precision intelligent manufacturing and strives to be a global leader in precision PICK & PLACE technology.
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News2024.05.17
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