From 5–7 May 2026, API will showcase its leading-edge advanced packaging solutions at SEMICON SEA in Kuala Lumpur, Malaysia, crossing borders to meet the industry!

Under the theme
“Intelligent Stack Die Bonding • Empowering SEA with Smart Packaging Solution”, we will deep-dive into the connectivity secrets of the AI and Industry 4.0 era.

Booth Information

· Venue: Malaysia International Trade and Exhibition Centre (MITEC), Kuala Lumpur

· Date: 5–7 May 2026

· Booth No.: 2381

Beyond Die Bonding | Addressing the “Core Questions” of Advanced Packaging

TCB for CPO | HBM | HBF | Glass Substrate
How do we break through physical limits and redefine advanced bonding standards for heterogeneous integration materials?

AP-TC2000
We will demonstrate on-site how, leveraging “Fabrication Lab”-level process flexibility, the system achieves precise control of temperature up to 400 °C and fine force control down to 0.7 N, delivering 1 µm @ 3σ ultra-high accuracy across complex heterogeneous materials.

AP-M3500 | Placement in the Industry 4.0 Era — How to Overcome “Collaboration Anxiety”?
Explore how, at ±3 µm accuracy, full AMHS (Automated Material Handling System) integration and end-to-end traceability enable multi-chip mass production to leap from automation to digital intelligence.

Top-Level Dialogues — An Experience Worth Your Time

This is more than an exhibition; it is a platform for Advanced packaging industry ideas.

· Industry leaders on site: Chairman & CEO, together with the core technical expert team, will be present throughout the event.

· Exclusive booth gifts: Visit our booth to receive limited-edition exhibition gifts (while stocks last).

Book Now and Start Your Smart Manufacturing Journey

Copy the link below into your browser to secure your entry pass:

https://register.semiconsea.org/event/2026/access-passes