KUALA LUMPUR, May 5, 2026 – SEMICON Southeast Asia, the region’s premier semiconductor event, officially kicked off today at the MITEC.
As a powerhouse in advanced packaging technology, API is making a bold statement at Booth 2381 under the theme: "Intelligent Stacked Die Bonding • Smart Packaging Solutions • Empowering SEA." This year, API is putting the spotlight on the critical building blocks of next-gen computing—including HBM, SiP, and 2.5D/3D stacking—delivering turnkey manufacturing solutions for AI clusters, New Energy Vehicles (NEV), and optical communications.
The surge in AI demand is pushing chip integration to its vertical limits. With Gartner projecting global semiconductor revenue to hit $1.3 trillion by 2026—and AI chips making up 30% of that market—the industry is pivoting toward ultra-high interconnect density. As 300mm fab spending climbs 18% this year to $133 billion (Source: SEMI), high-density solutions like HBM and 2.5D/3D stacking have become the primary engines for AI and NEV performance. API is meeting this demand head-on, delivering high-precision tools designed to redefine the infrastructure of modern computing.
Delivering extreme thermal precision and environmental control to solve heterogeneous integration challenges:
·High Precision: Delivers ±1μm @ 3σ placement accuracy, supported by an N2-protected environment and in-line plasma cleaning.
·Advanced Thermal Control: Supports Bond Head (BH) temperatures up to 400° with ultra-precise force control (0.7N - 50N).
·R&D Agility: Offers "Fab Lab" levels of flexibility with multiple material handling to support rapid development.
AP-M3500Series | Multi-Chip SiP Die Bonder
A pioneer in solving complex System-in-Package (SiP) challenges, the AP-M3500 combines extreme flexibility with high-speed, high-precision placement:
·Process Adaptability: Features 6-position collets changing and 5-set ejector systems.
·Consistent Accuracy: Maintains ±3μm placement precision with granular force control (0.1-10N).
·Material Handling: Fully compatible with diverse materials, including FR4, Leadframes, Carriers, and Wafers.
AP-M2000Series | Ultra-Thin-Die SiP Die Bonder
The definitive tool for memory chip stacking, engineered to push the boundaries of stacking:
·High-Count Stacking: Enables high-precision multi-layer stacking, integrated with vibration suppression and frictionless force control.
·Ultra-Thin Die Protection: Specialized handling for 25μm ultra-thin dies, featuring patented anti-die-cracking technology.
AP-SMART INLINE | Semiconductor Packaging Intelligent Inline Solution
Our flagship automated solution enables a closed-loop, fully integrated process:
·Full-Process Integration: Seamlessly unites Die Bonding, Plasma, AOI, and Holder Mounting into a single, intelligent workflow.
·Data-Driven Efficiency: Fully compliant with MES traceability and Industry 4.0 standards while engineered to maximize Overall Equipment Effectiveness (OEE).
Join us at Booth 2381 to see where advanced physics meets manufacturing excellence. At SEMICON SEA, API is doing more than showcasing hardware—we’re collaborating with industry titans to define the roadmap for the AI era.
We look forward to seeing you at MITEC, Kuala Lumpur!
