First in North America: More Than a Presence
On March 17, OFC 2026 officially opened at the Los Angeles Convention Center. By joining OFC—one of the most influential global platforms for optical communications—API aims to engage directly with international customers and partners, and to share our long-term commitment and continued investment in advanced packaging solutions.
Two Solution Highlights for Optical Communications
As AI data centers continue to drive higher bandwidth density, optical modules deployment is accelerating. Meanwhile, routes such as CPO and SiP multi-die integration are pushing the industry’s focus further toward manufacturing execution—where the controllability of precision, stability, yield, and production efficiency becomes critical to scalable deployment.
With this in mind, API is featuring two advanced packaging solutions for optical communications applications: AP-M3500 and TCB for CPO.
AP-M3500
Placement Accuracy: ±3 μm
AMHS: Support Industry 4.0
High Flexibility: Multi-chip Mounting
High Intelligence: Material Traceability; Self-Diagnosis
TCB for CPO
CPO-Ready Precision & Process Integrity: 1um @ 3o Placement Accuracy; Seamless In-Line Plasma & Full N2 Environment
Unmatched Process Flexibility for R&D and Production:“Fabrication Lab”Flexibility; Automated High-Mix Handling
Advanced Thermal Control for Heterogeneous Materials: Precise Bond Head Control (0.7N - 50N, up to 400°C); Custom Process Innovation
Looking ahead, API will continue strengthening core capabilities—precision, stability, and production consistency—and iterating solutions aligned with the equipment needs of advanced packaging. Together with global customers, we aim to help move technologies from validation to scalable adoption, enabling more efficient and reliable industrial deployment.
Over the next two days, the API team will remain on-site for discussions.
Visit us at West Hall – 5504.
