From May 20–22, the iconic Marina Bay Sands in Singapore once again became the heart of the global semiconductor industry. As Southeast Asia’s largest and most influential semiconductor exhibition, SEMICON SEA 2025 brought together innovators, solution providers, and thought leaders from across the globe- creating a dynamic platform for technological exchange and cross-border collaboration.

🚀 At this global stage, Attach Point proudly showcased our flagship solutions:

🔹AP-Smart Inline intelligent packaging line

🔹AP-M2000^Series for 3D ultra-thin stack die bonding

🔹AP-M3500^Series for high-speed multi-chip bonding placement

🔹AP-TC2000^Series for advanced wafer-level TCB bonding

Our high-precision, high-efficiency packaging solutions captured the attention of partners worldwide — not just as tools, but asfuture-ready enablersfor the next generation of semiconductor manufacturing.

✨ This event marked more than just a successful showcase. It was a testament to Touchpoint’s evolution — fromtechnology follower to standard-setterin advanced packaging, and a symbol of China’s growing strength in intelligent manufacturing.

🤝Collaboration has no borders. As we move forward, Touchpoint remains committed to driving innovation and fostering global partnerships. From R&D investment to ecosystem integration, our journey continues — smarter, stronger, and more connected than ever.

📍Next stop: SEMICON Taiwan 2025

📍See you again at SEMICON SEA 2026 in Kuala Lumpur!