API is a global manufacturer of high-precision semiconductor equipment, specializing in advanced packaging systems including Thermo-Compression Bonding (TCB) and Wafer-Level Hybrid Bonding (HB). Our commitment to innovation is backed by a highly technical workforce—over 52% of whom hold advanced degrees (Bachelor’s through PhD)—and a robust portfolio of nearly 100 patents. From our headquarters in Singapore, we operate a global service network across the United States, China, Japan, Malaysia, and Europe. Our technology is the backbone for critical industry drivers, including High-Bandwidth Memory (HBM), high-performance CPUs/GPUs, and 2.5D/3D packaging for AI applications.

Since our inception, API has focused on the mastery of core technologies such as motion control, precision machinery, thermo-flow simulation, and industrial software. This foundation allows us to deliver industry-leading die-attach solutions and specialized applications, including:

Smart inline solutions for CIS-COB processes
Ultra-thin die stacking bonders
3D multi-layer stacking thermo-compression bonders (TCB)

Our management and engineering teams are industry veterans, bringing an average of 10 to 30 years of experience from the world’s top semiconductor firms. This expertise, combined with our proven High-Volume Manufacturing (HVM) capacity, has made API a trusted partner for premier OSATs, IDMs, and camera-module manufacturers worldwide.

With a mission to drive the advancement of global precision intelligent manufacturing, API aims to become a global leader in precision pick-and-place technology. We remain customer-focused and strive to provide innovative micro-/nano-scale, high-tech equipment for advanced semiconductor packaging.