API is a global manufacturer of high-technology equipment specializing in advanced semiconductor packaging systems such as thermo-compression bonder (TCB) and wafer-level hybrid bonding (HB). Holders of bachelor’s, master’s, and doctoral degrees account for over 52% of our workforce. Our systems are used primarily in advanced packaging for HBM (high-bandwidth memory), high-performance CPUs/GPUs, and 2.5D/3D packaging for AI chips. Our service network spans Singapore, the United States, Japan, China, and other countries, offering comprehensive technical support and considerate services worldwide. 

Since its establishment, API has consistently invested in core technologies—including motion control, precision machinery, thermo flow simulation, optical imaging, micro-nano motor, and industrial software—and has delivered a new generation of advanced packaging solutions that comprehensively cover all die-attach processes.

API’s core technical and management team comprises seasoned experts from leading global semiconductor companies, each with 10 to 30 years of industry experience on average. Backed by a world-class founding team and a track record of high-quality delivery and service, API has earned recognition from top-tier semiconductor OSATs, IDMs, and camera-module manufacturers worldwide. With stable HVM (high-volume manufacturing) capacity, we are committed to creating value for our clients.

With a mission to drive the advancement of global precision intelligent manufacturing, API aims to become a global leader in precision pick-and-place technology. We remain customer-focused and strive to provide innovative micro-/nano-scale, high-tech equipment for advanced semiconductor packaging.