KUALA LUMPUR, May 7, 2026 – Following three days of high-level engagement and technical exchange, SEMICON Southeast Asia 2026 has officially drawn to a close at the MITEC.

Throughout this premier industry gathering, API Booth 2381 served as a hub for advanced packaging innovation. From deep dives into HBM stacking to the future of CPO integration, we engaged with global partners, technical experts, and longtime customers to discuss the roadmap for next-generation computing. The energy on-site was a testament to the industry’s shared vision for a high-performance future.

The API team showcased the critical role of TCB for CPO in micron-scale photonic integration. Our ±1μm bonding precision isn’t just a metric—it is the foundation upon which AI computing power evolves. Meanwhile, the AP-M2000’s prowess in ultra-thin-die stacking and the AP-M3500’s multi-substrate adaptability and Industry 4.0 readiness drew significant interest from manufacturers looking to scale complex SiP production. These technical dialogues are already translating into the momentum required for the industry’s next leap in growth.

Every successful conclusion marks the start of a new chapter.

API extends its sincere gratitude to the partners and customers who visited us. Your inquiries and insights are the catalysts that drive us to push the boundaries of physics. While the exhibition has ended, our mission to empower the semiconductor ecosystem continues. 

We look forward to seeing you again at SEMICON SEA 2027! 

May 25 – 27, 2027 | Booth 4172, Hall 1, Level 1