±7μm Placement
Die Attach & Flip Chip
0 Defect for Automotive Application
Cleanliness Class 10
Dispensing Process Expertise
8+ Years Stable & Reliable HVM
+30% High Throughput
Continuously Mass Production
Unmanned Automation Line
Flexible Configurations
MES Traceability
Automotive COB Process
| Item | Specifications |
| End Market | Consumer/Automotive |
| Application | CCM/Automotive/IOT-COB, 3D-ToF, Fingerprint Sensor, IR Camera Module, VCM etc |
| Material Handling | 4~12" Wafer, JEDEC Tray, Waffle Pack, etc |
| Process | Dispensing, Jetting, Stamping, DAF |
| Die Placement | ±7μm @3σ |
| UPH | Material Dependent |
| Footprint & Weight | Configuration Dependent |
Placement
Thin Die
Stacking
Class
±5μm Placement
Frictionless Precise Force Control
Vibration Suppression
25μm Die Thickness
32-Hi Stacking
Key OSAT/IDM Running HVM
Leading UPH & OEE
Compatible with All DRAM & Flash Processes
Support DAF & Epoxy
Patented Crack-Free Technology
Deep Learning AOI
Support Industry 4.0
| Item | Specifications |
| Wafer | 6" ~ 12" |
| Die Size | 0.8 ~ 25mm |
| Die Thickness | ≥ 25μm |
| Strip Length | 130 ~ 300mm |
| Strip Width | 55～100mm (Optional ＜55mm ) |
| Bond Force | 0.5 ~ 50N (70N optional) |
| Die Placement | ±5μm @3σ |
| Item | Specifications |
| Process | DAF & Epoxy |
| Cycle Time | Material Dependent |
| Heater Block | Max 250 ℃ (±5 ℃) |
| Die Stacking | YES |
| Packages | BGA, QFP, QFN etc |
| Footprint | 2292 x 1551 x 1900mm (LxDxH) |
| Weight | 2450kg |
Placement
Industry 4.0
Flexibility
Footprint Size
XY Placement: ±3μm@3σ
Theta Rotation: 0.07°@3σ
Force Control: 0.1-10N±10%
Precise BLT Control
Industry-Leading UPH
Extremely User-Friendly
High Speed Mode with ±10μm Placement
Easy Process Changing
Easy Product Conversion
Auto Tool Changing
Support SECS/GEM, Inline, OHT, AGV
Post-Disp/Bond Smart Inspection
FM/Crack Detection
Machine Health Self-Checking
| Item | Specifications |
| Application | Photonics, Transceiver, SiP, LIDAR, Camera Module, etc. |
| Die Size | 0.15-25mm |
| Die Thickness | 0.025-7.0mm |
| Bond Force | 0.05-10N±10% |
| Die Placement | ±3μm@3σ, 0.07°@3σ |
| Attach Process | COB, FC, DA with Epoxy/Silver Paste/UV Glue |
| Item | Specifications |
| Substrate | L: 130-260mm x W: 55-140mm |
| Material Handling | FR4, Leadframe, Strips, Carrier, Boat, Ceramics 6"-12" Wafer, Gel-pak, Waffle Pack, Tray, Feeder |
| Bondhead | 6 Collets Auto Changing, Heating, UV, Confocal Height Measurement |
| Ejector System | 4 sets Auto Changing |
| Footprint (mm) | 1240x1553x2060 (LxDxH) |
