From September 2 to 4, 2026, SEMICON Taiwan took center stage at the Taipei Nangang Exhibition Center. As a key global equipment provider in advanced semiconductor packaging, API made a prominent appearance at Booth N1285, showcasing its cutting-edge packaging systems and end-to-end automated line solutions.

Highlighting its technology leadership, API debuted five flagship innovations engineered for CPO, 2.5D stacking, HBM architectures, and Industry 4.0 manufacturing. On day one, the booth attracted significant attention from tier-one industry players, including leading global wafer foundries. Customers commended API’s technological edge and execution, expressing strong confidence in the company’s market growth and long-term trajectory.

5 Core Solutions Powering Advanced Packaging Innovation

GEMINI PRO | Wafer-Level Fan-Out Bonder

Engineered for high-precision wafer-level fan-out applications, the Gemini Pro delivers exceptional placement accuracy of ±2μm @ 3σ. It easily accommodates diverse processes—including EB Die, Dummy Die, and VFO—while supporting advanced 16Hi+ stacking. Featuring integrated 6-side inspection, the platform provides end-to-end defect detection to ensure yield and package reliability.

NUERA PRO | Fluxless Thermo-Compression Bonder

Purpose-built for ultra-fine pitch memory and logic packaging (HBM/xPU), the NuEra Pro achieves ±1μm @ 3σ flip-chip accuracy. The system seamlessly supports both TC Flux and Fluxless bonding modes, offering versatile substrate handling across 12" wafers, 310×310mm panels/substrates, and strip/boat carriers to power next-generation, high-density multi-die integration.

AP-M3500 ^Series | Multi-Chip SiP Die Bonder

Targeting high-throughput multi-die bonding, the AP-M3500 delivers ±3μm placement accuracy combined with seamless automated material handling integration. Fully compatible with Inline configurations, OHT, and AGVs, it offers end-to-end lot traceability and automated self-diagnostics-paving the way for fully automated, lights-out fab manufacturing.

AP-M2000 ^Series | Ultra-Thin Die SiP Die Bonder

Designed for advanced Flash and DRAM packaging, this 3D stacking die bonder delivers ±5μm@3σ accuracy while handling ultra-thin dies down to 25μm and supporting reliable stacking up to 32-Hi. Featuring friction-free fine force control, active vibration dampening, patented anti-die-crack technology, and deep learning-powered AOI, the AP-M2000 directly addresses the industry's push toward high-density, ultra-reliable memory storage.

AP-SMART INLINE | Automotive-Grade Smart Manufacturing

Moving beyond standalone bonders, this fully integrated line solution covers mobile/automotive CMOS and LiDAR module assembly. Combining ±7μm precision with real-time active alignment, it comfortably meets stringent automotive zero-defect standards. Featuring full MES traceability and broad process support (COB, BGA, DAF), AP-SMART INLINE scales high-resolution optical packaging into efficient, intelligent mass production.

Let's Connect in Taipei!

As SEMICON Taiwan continues through September 5th, our technical team is ready to discuss how API can help accelerate your advanced packaging capabilities.

Visit us at Hall 1, 4F — Booth N1285 (Sept 2-4)

Let’s shape the future of semiconductors, together.