TAIPEI, Taiwan – September 4, 2026 — SEMICON Taiwan 2026 officially wrapped up today following three dynamic days under the banner, "Transform Tomorrow."API concluded a highly successful showcase in Taipei, marked by exceptional booth traffic, strong engagement from global semiconductor leaders, and productive technical exchanges. Over the course of the event, our team delivered a solid showcase of next-gen advanced packaging technologies.

Take a quick look back at three days of non-stop energy, live discussions, and technical showcases at Booth N1285!

Throughout the show, API’s teams engaged in deep-dive discussions with global Tier-1 OSATs, IDMs, and foundry partners. Meetings focused on technical specifications, process fit, and high-volume manufacturing (HVM) readiness.

International customer delegations showed strong interest in GEMINI PRO, NUERA PRO and AP-M3500 Inline bonding platforms. Discussions centered on tackling key packaging bottlenecks, including heterogeneous bonding, warpage control, and seamless AMHS fab integration.

The overwhelming interest from leading global semiconductor players is a strong validation of API’s platform performance, equipment stability, and scalable production capabilities. As advanced packaging becomes the cornerstone of next-generation semiconductor innovation, API continues to earn the trust of industry leaders worldwide.

SEMICON Taiwan 2026 may be over, but our drive for innovation never stops. A sincere thank you to all the partners, customers, and industry colleagues who stopped by our booth. If you have follow-up inquiries regarding our solutions or technical specs, feel free to reach out to our team—we are here to support your upcoming projects.

NEXT STOP: CIOE 2026 IN SHENZHEN

Join API at the 25th China International Optoelectronic Exposition (CIOE) from September 9–11.

Shenzhen World Exhibition & Convention Center — Booth 10B69

See you in Shenzhen!